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1 double-crucible method
double-crucible method Doppeltiegelmethode f (Kristallzüchtung)English-German dictionary of Electrical Engineering and Electronics > double-crucible method
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2 double-crucible method
box method — метод «ящика»
English-Russian big polytechnic dictionary > double-crucible method
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3 double-crucible method
Большой англо-русский и русско-английский словарь > double-crucible method
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4 double-crucible method
Англо-русский словарь технических терминов > double-crucible method
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5 double-crucible method
2) Электроника: метод двойного тигляУниверсальный англо-русский словарь > double-crucible method
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6 double-crucible method
метод подвійного тигляEnglish-Ukrainian dictionary of microelectronics > double-crucible method
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7 double crucible method
nOPT método de crisol doble mEnglish-Spanish technical dictionary > double crucible method
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8 double-crucible method
English-Russian dictionary of microelectronics > double-crucible method
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9 method
1) метод; приём; способ2) методика3) технология4) система•- accelerated strength testing method-
benching method-
bullhead well control method-
electrical-surveying method-
electromagnetic surveying method-
long-wire transmitter method-
operational method-
rule of thumb method-
straight flange method of rolling beams-
symbolical method-
tee-test method-
testing method-
triangulation method-
value-iteration method -
10 double
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11 method
метод (див. т-ж approach, technique) - method of short circuits time constants
- aligning method
- angle-lappingmethod
- angle-lapmethod
- batch method
- Bridgeman-Stockbarger method
- computerized reliability analysis method
- critical path method
- crucibleless method
- CZ Czochralski method
- CZ method
- directional etch method
- double-crucible method
- edge-based method
- epitaxial isolation method
- event-driven method
- Euler’s method
- fault driven method
- finite-difference method
- finite-element method
- flip-chip method
- floating -zone method
- float -zone method
- four-point probe method
- four probe method
- greedy method
- Green function method
- hand-drafted method
- horizontal Bridgeman method
- LEC liquid encapsulated Czochralski method
- LEC method
- low-pressure triode method
- manufacturing method
- masking method
- MCmethod
- method modified nodal analysis method
- Monte-Carlo method
- noncontact method
- over-under probe method
- photolithography method
- photomasking method
- scan direct access method
- scan-path method
- screening method
- self-aligning method
- silicon compiler method
- single-mask method
- standard-сеll method
- standing-wave method
- state variable method
- step-and-repeat multilens method
- step-and-repeat multiple-pinhole method
- symbolic layout method
- weak beam method
- wire method
- wire-wrap method -
12 метод двойного тигля
Русско-английский словарь по микроэлектронике > метод двойного тигля
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13 способ двойного тигля
Большой англо-русский и русско-английский словарь > способ двойного тигля
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14 способ двойного тигля
double-crucible method, ( для выработки стекловолокна) double-crucible processАнгло-русский словарь технических терминов > способ двойного тигля
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15 способ двойного тигля
double-crucible method, ( для выработки стекловолокна) double-crucible processРусско-английский политехнический словарь > способ двойного тигля
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16 способ двойного тигля
1) Engineering: double-crucible method (в производстве оптического стекловолокна), double-crucible process (для выработки стекловолокна)Универсальный русско-английский словарь > способ двойного тигля
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17 метод двойного тигля
Electronics: double-crucible methodУниверсальный русско-английский словарь > метод двойного тигля
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18 Doppeltiegelmethode
Deutsch-Englisch Wörterbuch der Elektrotechnik und Elektronik > Doppeltiegelmethode
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19 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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20 Boulsover, Thomas
[br]b. 1704d. 1788[br]English cutler, metalworker and inventor of Sheffield plate.[br]Boulsover, originally a small-scale manufacturer of cutlery, is believed to have specialized in making knife-handle components. About 1742 he found that a thin sheet of silver could be fused to copper sheet by rolling or beating to flatten it. Thus he developed the plating of silver, later called Sheffield plate.The method when perfected consisted of copper sheet overlaid by thin sheet silver being annealed by red heat. Protected by iron sheeting, the copper and silver were rolled together, becoming fused to a single plate capable of undergoing further manufacturing processes. Later developments included methods of edging the fused sheets and the placing of silver sheet on both lower and upper surfaces of copper, to produce high-quality silver plate, in much demand by the latter part of the century. Boulsover himself is said to have produced only small articles such as buttons and snuff boxes from this material, which by 1758 was being exploited more commercially by Joseph Hancock in Sheffield making candlesticks, hot-water pots and coffee pots. Matthew Boulton introduced its manufacture in very high-quality products during the 1760s to Birmingham, where the technique was widely adopted later. By the 1770s Boulsover was engaged in rolling his plated copper for industry elsewhere, also trading in iron and purchasing blister steel which he converted by the Huntsman process to crucible steel. Blister steel was converted on his behalf to shear steel by forging. He is thought to have also been responsible for improving this product further, introducing "double-shear steel", by repeating the forging and faggoting of shear steel bars. Thomas Boulsover had become a Sheffield entrepreneur, well known for his numerous skills with metals.[br]Further ReadingH.W.Dickinson, 1937, Matthew Boulton, Cambridge: Cambridge University Press (describes Boulsover's innovation and further development of Sheffield plate).J.Holland, 1834, Manufactures in Metal III, 354–8.For activities in steel see: K.C.Barraclough, 1991, "Steel in the Industrial Revolution", in J.Day and R.F.Tylecote (eds), The Industrial Revolution in Metals, The Institute of Metals.JD
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